0.671W/for Thermal Compound Thermal Grease for CPU Coolers Processor Ovens Chipset Cooli Notebook Cooling Fan Internal Fans Pc Notebook Cooling Stand Heatsinks for Cpu

2 Pieces Silicone Thermal Grease Compound 0.671W/for M.K For Processor CPU Radiator Card Cooli2Pcs Heatsink Plaster Thermal Silicone Adhesive Cooling Compound Features 1. It has good conductivity and wide service temperature 60200℃ short term 300℃ high temperature. 2. The curing for the adhesive force is strong, the storage period is long, and 3. applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, LED, heat sinks and other 4. It is suitable for all kinds of components, LED and heat dissipation devices which need to be directly. It has high strength and fast adhesion effect. Specifications:Color: White Weight: approx. 10g Adhesive type: memory.MOSFET heat sink fin heat sink. Bridge adhesive type: other Shear strength: Active use period: 10 (min) Solidification time: 25C Thermal conductivity: >0.671W/for m.k curing time: 10MIN/25℃ Length :5.5cm（2.17in） Quantity: 2Pcs Manual: 1. When it is used, the product is directly extruded, rubbed and to the of the adhesive, immediately after the test, so as to be tried again. 2. The fixed speed is related to the relative and temperature the the temperature, the faster the curing rate is, the slower the 3. Recommended coating thickness: 0.1-0.5mm, the 4. Before use, please (such as adhesive detergents should be to be before painting. Note:Please allow 1-3 for cm differs due to manual measurement. Due to